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Area Mount Engineering (SMT) Assembly process

Compared with thru-hole mounting process, floor mounting procedure stands out when it comes to producing efficiency as it features a completely computerized mounting PCB assembly approach from solder paste printing, choose and place and reflow soldering.

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Move one: Solder paste printing - Solder paste is used to the board through a solder paste printer. A template assures that solder paste could be precisely left on accurate locations wherever parts will probably be mounted, that's also referred to as stencil or solder display screen. For the reason that high-quality of solder paste printing is immediately connected with high quality of soldering, PCBA producers specializing in higher top quality items typically execute inspections soon after solder paste printing by way of a solder paste inspector. This inspection guarantees printing has reached laws and benchmarks. If flaws are discovered on solder paste printing, printing has to be reworked or solder paste is going to be washed off prior to next printing.

Action two: Factors Mounting - After popping out of solder paste printer, PCB will be auto-sent to pick-and-place equipment where parts or ICs might be mounted on corresponding pads during the influence of rigidity of solder paste. parts are mounted on PCB board by way of element reels during the device. Comparable to film reels, ingredient reels carrying parts rotate to offer elements towards the machine, which can swiftly stick parts on the board.

Stage three: Reflow Soldering - Soon after every single element is positioned, the board passes via a 23-foot-long furnace. A temperature of 500°F brings about the solder paste to liquefy. Now the SMD elements are certain firmly for the board.

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